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The ornamental design for an outer surface portion of an electronic enclosure, as shown and described. |
FIG. 1 is a perspective view of an outer surface portion of an electronic enclosure showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a left side elevational view thereof; and,
FIG. 5 is a right side elevational view thereof.
The broken line drawing of a portion of an electronic enclosure in all figure views is for illustrative purposes only and forms no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 20 1997 | VACKAR, MARK A | Toshiba International Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008680 | /0753 | |
Aug 25 1997 | Toshiba International Corporation | (assignment on the face of the patent) | / |
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