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The ornamental design for a disc holding tool, as shown and described. |
FIG. 1 is a perspective view of a disc holding tool, showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof, the rear elevational view being symmetrical thereto;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a perspective view of the disc holding tool in use.
The broken lines shown in the drawings are for environmental purposes and form no part of the claimed design.
Patent | Priority | Assignee | Title |
D911986, | May 03 2019 | Raytheon Company | Handheld semiconductor wafer handling tool |
ER7057, | |||
ER7780, |
Patent | Priority | Assignee | Title |
3360808, | |||
4410209, | Mar 11 1982 | Wafer-handling tool | |
D349226, | May 10 1993 | Grinding wheel dressing tool |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 13 1997 | Nippon Light Metal Company Ltd. | (assignment on the face of the patent) | / | |||
Aug 20 1997 | KOBAYASHI, YASUSHI | NIPPON LIGHT METAL COMPANY LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008731 | /0373 |
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