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The ornamental design for a heat dissipation fan, as shown and described. |
FIG. 1 is a perspective view of the heat dissipation fan in accordance with the first embodiment of the claimed design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a perspective view of the heat dissipation fan in accordance with the second embodiment of the claimed design;
FIG. 9 is a top plan view of FIG. 8;
FIG. 10 is a right side elevational view of FIG. 8;
FIG. 11 is a front elevational view of FIG. 8;
FIG. 12 is a rear elevational view of FIG. 8;
FIG. 13 is a left side elevational view of FIG. 8; and,
FIG. 14 is a bottom plan view of FIG. 8.
Patent | Priority | Assignee | Title |
8647077, | Feb 20 2004 | Hewlett Packard Enterprise Development LP | Cooling fan for electronic device |
D598089, | Mar 24 2009 | CompTake Technology Inc. | Heat dissipating fan |
ER1239, | |||
ER4736, | |||
ER5136, |
Patent | Priority | Assignee | Title |
5309983, | Jun 23 1992 | PCUBID COMPUTER TECHNOLOGY INC | Low profile integrated heat sink and fan assembly |
5494098, | Jun 17 1994 | THERMAL FORM & FUNCTION LLC | Fan driven heat sink |
5582506, | Mar 06 1995 | SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO , LTD | Fan assembly for an integrated circuit |
5629834, | Aug 20 1993 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
5638895, | Mar 25 1996 | OCZ TECHNOLOGY GROUP, INC | Twin fan cooling device |
5689404, | Mar 17 1995 | Fujitsu, Ltd. | Heat sink having air movement device positioned among tins and between heating elements |
DE3408139, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 25 1997 | HORNG, ALEX | SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008768 | /0913 | |
Oct 07 1997 | Sunonwealth Electric Machine Industry Co., Ltd. | (assignment on the face of the patent) | / |
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