Patent
   D401249
Priority
Aug 12 1997
Filed
Aug 12 1997
Issued
Nov 17 1998
Expiry
Nov 17 2012
Assg.orig
Entity
unknown
1
2
n/a
The ornamental design for a roller for a wire saw for semiconductors, as shown and described.

FIG. 1 is a front elevational view of a roller for a wire saw for semiconductors, the rear elevational view being a mirror image of FIG. 1;

FIG. 2 is a top plan view thereof, the bottom plan view being identical with FIG. 2;

FIG. 3 is a right side elevational view thereof, the left side elevational view being identical with FIG. 3;

FIG. 4 is a perspective view thereof; and,

FIG. 5 is a referential view showing location of the present article in a wire saw for semiconductors.

Kawakita, Akio

Patent Priority Assignee Title
D427219, Jul 22 1997 MEAD CORPORATION, THE Surface pattern for a dandy roll screen
Patent Priority Assignee Title
5715807, Apr 14 1995 Shin-Etsu Handotai Co., Ltd.; Mimasu Semiconductor Industry Co., Ltd. Wire saw
D369361, Dec 13 1994 Satake Corporation Roller of a roll unit for use in flour milling machines
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 12 1997Nippei Toyama Corporation(assignment on the face of the patent)
Sep 30 1997KAWAKITA, AKIONippei Toyama CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0087710801 pdf
Oct 01 2008Nippei Toyama CorporationKOMATSU NTC LTD CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0220340977 pdf
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