|
The ornamental design for an electronics housing, as shown and described. |
FIG. 1 is a perspective view of an electronics housing of my design;
FIG. 2 is a front view of the electronics housing of FIG. 1;
FIG. 3 is an end view of the electronics housing shown in FIG. 1;
FIG. 4 is a bottom view of the electronics housing shown in FIG. 1;
FIG. 5 is an opposite end view of the electronics housing shown in FIG. 1; and,
FIG. 6 is a rear view of the electronics housing shown in FIG. 1.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 03 1997 | HEIJNEN, LUC | Motivision Worldwide PLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008493 | /0638 | |
Feb 04 1997 | Motivision Worldwide PLC | (assignment on the face of the patent) | / |
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