|
The ornamental design for a modular housing for electrical circuits, as shown and described. |
FIG. 1 is a front perspective view of the modular housing for electrical circuits;
FIG. 2 is a rear perspective view of the unit of FIG. 1;
FIG. 3 is a front view of the unit of FIG. 1;
FIG. 4 is a top view of the unit of FIG. 1;
FIG. 5 is a left side view of the unit of FIG. 1;
FIG. 6 is a right side view of the unit of FIG. 1;
FIG. 7 is a bottom view of the unit of FIG. 1; and,
FIG. 8 is a rear view of the unit of FIG. 1.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 11 1997 | Pilz GmbH & Co. | (assignment on the face of the patent) | / |
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