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The ornamental design for a connection module for a pcb (printed circuit board), as shown and described. |
FIG. 1 is a front elevation view showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side elevation view thereof;
FIG. 4 is a rear elevation view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a perspective view thereof.
Mossner, Frank, Zimmer, Sabine
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 25 1997 | ZIMMER, SABINE | Krone Aktiengesellschaft | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008765 | /0661 | |
Sep 25 1997 | MOSSNER, FRANK | Krone Aktiengesellschaft | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008765 | /0661 | |
Oct 02 1997 | Krone Aktiengesellschaft | (assignment on the face of the patent) | / | |||
Dec 23 1999 | Krone Aktiengesellschaft | Krone GmbH | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010804 | /0358 | |
Aug 30 2004 | APTUS 50 GMBH | Krone GmbH | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 019009 | /0682 | |
Aug 30 2004 | Krone GmbH | APTUS 50 GMBH | DIVESTMENT AGREEMENT | 019009 | /0704 | |
Apr 06 2005 | Krone GmbH | ADC GmbH | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 019015 | /0074 | |
Aug 28 2015 | CommScope EMEA Limited | CommScope Technologies LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 037012 | /0001 |
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