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The ornamental design for a wafer pod, as shown and described. |
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FIG. 1 is a perspective view of a wafer pod showing the preferred embodiment of my new design;
FIG. 2 is a front elevational view of the wafer pod;
FIG. 3 is a rear elevational view of the wafer pod;
FIG. 4 is a left elevational side view of the wafer pod;
FIG. 5 is a right elevational side view of the wafer pod;
FIG. 6 is a top plan view of the wafer pod; and,
FIG. 7 is a bottom plan view of the wafer pod.
Huang, Gwo-Jou, Fan, Horng-Kuang
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jul 17 1997 | FAN, HORNG-KUANG | Industrial Technology Research Institute | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008806 | /0038 | |
| Jul 17 1997 | HUANG, GWO-HOU | Industrial Technology Research Institute | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008806 | /0038 | |
| Aug 12 1997 | Industrial Technology Research Institute | (assignment on the face of the patent) | / |
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