Patent
   D414503
Priority
Sep 24 1997
Filed
Mar 20 1998
Issued
Sep 28 1999
Expiry
Sep 28 2013
Assg.orig
Entity
unknown
4
2
n/a
The ornamental design for machine for forming a semiconductor wafer film, as shown.

FIG. 1 is a front elevational view of machine for forming a semiconductor wafer film, showing my new design;

FIG. 2 is a right side elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Katoh, Susumu

Patent Priority Assignee Title
6281511, Oct 06 1998 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Apparatus for forming materials
D754765, Apr 16 2014 Nimatic APS Fluid mixer
D823363, Feb 12 2016 KOKUSAI ELECTRIC CORPORATION Heater of substrate processing apparatus
D824440, Feb 12 2016 KOKUSAI ELECTRIC CORPORATION Heater of substrate processing apparatus
Patent Priority Assignee Title
5311103, Jun 01 1992 Board of Trustees Operating Michigan State University Apparatus for the coating of material on a substrate using a microwave or UHF plasma
5863327, Feb 10 1997 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Apparatus for forming materials
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 13 1998KATOH, SUSUMU Tokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0090620022 pdf
Mar 20 1998Tokyo Electron Limited(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule