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			 The ornamental design for machine for forming a semiconductor wafer film, as shown.  | 
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FIG. 1 is a front elevational view of machine for forming a semiconductor wafer film, showing my new design;
FIG. 2 is a right side elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc | 
| Mar 13 1998 | KATOH, SUSUMU | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009062 | /0022 | |
| Mar 20 1998 | Tokyo Electron Limited | (assignment on the face of the patent) | / | 
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