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The ornamental design for an ic test-head stand, as shown and described. |
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FIG. 1 is a perspective view of an IC test-head stand according to a first embodiment of the present design.
FIG. 2 is a front view of the IC test-head stand shown in FIG. 1. A rear view of the IC test-head stand is omitted from the drawing since the rear view is symmetrical with the front view.
FIG. 3 is a left side view of the IC test-head stand shown in FIG. 1.
FIG. 4 is a right side view of the IC test-head stand shown in FIG. 1.
FIG. 5 is a top plan view of the IC test-head stand shown in FIG. 1.
FIG. 6 is a bottom plan view of the IC test-head stand shown in FIG. 1.
FIG. 7 is a perspective view of an IC test-head stand according to a second embodiment of the present design.
FIG. 8 is a front view of the IC test-head stand shown in FIG. 7. A rear view of the IC test-head stand is omitted from the drawing since the rear view is symmetrical with the front view.
FIG. 9 is a left side view of the IC test-head stand shown in FIG. 7.
FIG. 10 is a right side view of the IC test-head stand shown in FIG. 7.
FIG. 11 is a top plan view of the IC test-head stand shown in FIG. 7.
FIG. 12 is a bottom plan view of the IC test-head stand shown in FIG. 7.
FIG. 13 is a perspective view of an IC test-head stand according to a third embodiment of the present design.
FIG. 14 is a front view of the IC test-head stand shown in FIG. 13. A rear view of the IC test-head stand is omitted from the drawing since the rear view is symmetrical with the front view.
FIG. 15 is a left side view of the IC test-head stand shown in FIG. 13.
FIG. 16 is a right side view of the IC test-head stand shown in FIG. 13.
FIG. 17 is a top plan view of the IC test-head stand shown in FIG. 13.
FIG. 18 is a bottom plan view of the IC test-head stand shown in FIG. 13; and,
FIG. 19 is a front view of the IC test-head stand shown in FIG. 1, for illustrating the use of the IC test-head stand.
The broken line showing is for illustrative purposes only and forms no part of the claimed design.
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| D706651, | Mar 16 2012 | JANESKO OY | Process temperature probe |
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| Patent | Priority | Assignee | Title |
| D286698, | Feb 13 1984 | Planhorse International (NZ) Limited | Cart |
| D383582, | Sep 05 1996 | Snow removal device |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Dec 30 1998 | Advantest Corporation | (assignment on the face of the patent) | / | |||
| Feb 18 1999 | YANO, TAKAYUKI | Advantest Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009823 | /0530 |
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