Patent
   D421924
Priority
Feb 18 1999
Filed
Feb 18 1999
Issued
Mar 28 2000
Expiry
Mar 28 2014
Assg.orig
Entity
unknown
1
1
n/a
The ornamental design for a thermocouple module, as shown and described.

FIG. 1 shows a front view of my design for a thermocouple module;

FIG. 2 shows a rear view thereof;

FIG. 3 shows a right side view thereof;

FIG. 4 shows a left side view thereof;

FIG. 5 shows a bottom view thereof; and,

FIG. 6 shows a plan view thereof.

Luo, Ji Lie, Shu, Deng Wei

Patent Priority Assignee Title
D973520, Aug 31 2020 KOKUSAI ELECTRIC CORPORATION Temperature sensor
Patent Priority Assignee Title
4527005, Mar 13 1984 The United States of America as represented by the United States Spring loaded thermocouple module
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 03 1999LUO, JI LIEPrecision Mastech Enterprises CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0097820697 pdf
Feb 03 1999SHU, DENG WEIPrecision Mastech Enterprises CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0097820697 pdf
Feb 18 1999Precision Mastech Enterprises Company(assignment on the face of the patent)
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