|
The ornamental design for a thermocouple module, as shown and described. |
FIG. 1 shows a front view of my design for a thermocouple module;
FIG. 2 shows a rear view thereof;
FIG. 3 shows a right side view thereof;
FIG. 4 shows a left side view thereof;
FIG. 5 shows a bottom view thereof; and,
FIG. 6 shows a plan view thereof.
Patent | Priority | Assignee | Title |
D973520, | Aug 31 2020 | KOKUSAI ELECTRIC CORPORATION | Temperature sensor |
Patent | Priority | Assignee | Title |
4527005, | Mar 13 1984 | The United States of America as represented by the United States | Spring loaded thermocouple module |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 03 1999 | LUO, JI LIE | Precision Mastech Enterprises Company | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009782 | /0697 | |
Feb 03 1999 | SHU, DENG WEI | Precision Mastech Enterprises Company | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009782 | /0697 | |
Feb 18 1999 | Precision Mastech Enterprises Company | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |