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The ornamental design for a substrate fixturing device, as shown and described. |
FIG. 1 is a perspective view of the substrate fixturing device;
FIG. 2 is an enlarged perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a left side view thereof, and the right side view thereof is a mirror image of the left side view; and,
FIG. 6 is a front view thereof.
The back view of the substrate fixturing device is plain and unornamented. The broken line illustration in the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.
Jahani, Hooshang, Bruner, Scott R., Smith, Peter F.
Patent | Priority | Assignee | Title |
8635784, | Oct 04 2005 | Applied Materials, Inc | Methods and apparatus for drying a substrate |
ER5672, |
Patent | Priority | Assignee | Title |
4313266, | May 01 1980 | The Silicon Valley Group, Inc. | Method and apparatus for drying wafers |
4318749, | Jun 23 1980 | Intersil Corporation | Wettable carrier in gas drying system for wafers |
4572101, | May 13 1983 | ASQ BOATS, INC | Side lifting wafer boat assembly |
4735540, | Nov 15 1985 | Komag, Inc. | Robotic disk handler system |
4736759, | Feb 21 1986 | FSI International, Inc | Apparatus for cleaning rinsing and drying substrates |
4789026, | Jun 26 1987 | Thermacore, Inc. | Polished surface capillary grooves |
4872554, | Jul 02 1987 | Entegris, Inc | Reinforced carrier with embedded rigid insert |
4902186, | Dec 09 1988 | Intelmatec Corporation | Disk guide for a disk handling system |
4903168, | Apr 22 1988 | AG COMMUNICATION SYSTEMS CORPORATION, 2500 W UTOPIA RD , PHOENIX, AZ 85027, A DE CORP | Substrate carrier device |
4993559, | Jul 31 1989 | Freescale Semiconductor, Inc | Wafer carrier |
5057151, | Nov 25 1988 | Wacker-Chemie GmbH | Process for preparing hydrophobic particulate solids containing Si-OH groups and a process for using the same |
5232503, | Oct 07 1991 | Intevac, Inc | Apparatus for evaporatively coating objects with a predetermined thickness profile |
5295777, | Dec 23 1992 | Tokyo Electron Limited | Wafer transport module with rotatable and horizontally extendable wafer holder |
5403401, | Mar 04 1993 | XYCARB B V A DUTCH CORPORATION | Substrate carrier |
5445172, | May 18 1990 | Semitool, Inc. | Wafer holder with flexibly mounted gripping fingers |
5455062, | May 28 1992 | HAMATECH APE GMBH & CO KG | Capillary device for lacquering or coating plates or disks |
5534074, | May 17 1995 | Heraeus Amersil, Inc. | Vertical boat for holding semiconductor wafers |
5542550, | Jul 20 1994 | Dionisis, Kakavoulis-Perera | Storage rack for holding articles in a cantilever fashion |
5555634, | Jan 18 1994 | Shin-Etsu Handotai Co., Ltd. | Wafer holder |
5584401, | Jul 29 1994 | Yodogawa Kasei Kabushiki Kaisha | Substrate-supporting side boards and a cassette utilizing the boards |
5584917, | Jul 04 1994 | Taiho Industries Co., Ltd.; Toshiba Silicone Co., Ltd. | Water repellent for window panes of automobiles and method of repelling water on the window panes |
5668056, | Dec 17 1990 | United Microelectronics Corporation | Single semiconductor wafer transfer method and manufacturing system |
5704493, | Dec 27 1995 | SCREEN HOLDINGS CO , LTD | Substrate holder |
5749469, | May 15 1992 | Entegris, Inc | Wafer carrier |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 16 1998 | JAHANI, HOOSHANG | Tooltek Engineering Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009706 | /0873 | |
Dec 16 1998 | BRUNER, SCOTT R | Tooltek Engineering Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009706 | /0873 | |
Dec 16 1998 | SMITH, PETER F | Tooltek Engineering Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009706 | /0873 | |
Jan 07 1999 | Tooltek Engineering Corporation | (assignment on the face of the patent) | / |
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