Patent
   D424077
Priority
Feb 22 1999
Filed
Feb 22 1999
Issued
May 02 2000
Expiry
May 02 2014
Assg.orig
Entity
unknown
9
13
n/a
The ornamental design for a soldering and desoldering tool controller, as shown and described.

FIG. 1 is a perspective view of the soldering and desoldering tool controller;

FIG. 2 is a top view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a front view thereof;

FIG. 5 is a left side view thereof; and,

FIG. 6 is a right side view thereof.

The bottom view of the soldering and desoldering tool controller is plain and unornamented.

Abed, Tark, Hanna, Shawn

Patent Priority Assignee Title
7126084, May 20 2004 Campbell Hausfeld/Scott Fetzer Company Welder
D530349, Nov 09 2004 Hakko Corporation Controller for soldering iron
D576459, Apr 12 2007 Hakko Corporation Controller for soldering irons
D590853, Jun 14 2007 Hakko Corporation Soldering controller
D656525, Mar 10 2011 Hakko Corporation Controller for soldering
D762254, Dec 17 2014 Hakko Corporation Controller for soldering iron
D762754, Dec 17 2014 Hakko Corporation Controller for desoldering tool
D780241, Nov 27 2015 Hakko Corporation Controller for soldering iron
D829790, Nov 27 2017 GUANGZHOU YIHUA ELECTRONIC EQUIPMENT CO , LTD Soldering station
Patent Priority Assignee Title
4230250, Apr 30 1979 AUTOMATED PRODUCTION EQUIPMENT CORP M Solder extractor
4289953, Feb 09 1979 AUTOMATED PRODUCTION EQUIPMENT CORP M Electrically heated solder extractor
4569473, Nov 03 1983 Apparatus for and method of desoldering and removing an integrated circuit from a mounting member and for cleaning the same
4659004, Feb 24 1984 PACE, INCORPORATED, A CORP OF MARYLAND Device for attaching modular electronic components to or removing them from an insulative device
4752025, May 22 1987 Austin American Technology Surface mount assembly repair terminal
4767047, Feb 01 1986 GENERAL ELECTRIC COMPANY, P L C , THE, 1 STANHOPE GATE, LONDON W1A 1EH UNITED KINGDOM Desoldering device
4799617, Oct 09 1987 Advanced Techniques Co., Inc. Convection heat attachment and removal instrument for surface mounted assemblies
4832249, Jul 03 1986 Telefunken Systemtechnik GmbH Method and arrangement for reflow soldering and reflow unsoldering of circuit boards
5340011, Dec 09 1992 LSI LOGIC CORPORATTION Adjustable height work holder for bonding semiconductor dies
5419481, Sep 21 1993 Air-Vac Engineering Company, Inc. Process and apparatus for attaching/deataching land grid array components
5560531, Dec 14 1994 Delaware Capital Formation, Inc Reflow minioven for electrical component
5598965, Nov 03 1994 Integrated circuit, electronic component chip removal and replacement system
D277636, May 13 1981 COOPER GROUP DEUTSCHLAND GMBH, THE Control housing for a soldering device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 22 1999Metcal, Inc.(assignment on the face of the patent)
Apr 06 1999ABED, TARKMETCAL, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0099340813 pdf
Apr 06 1999HANNA, SHAWNMETCAL, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0099340813 pdf
Mar 01 2001METCAL, INC,DOVER TECHNOLGIES INTERNATIONAL, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0115900772 pdf
Mar 07 2001DOVER TECHNOLOGIES INTERNATIONAL, INC Delaware Capital Formation, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0116820668 pdf
Apr 19 2002METCAL, INC Delaware Capital Formation, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128410769 pdf
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