Hinge unit for vacuum-processing a semiconductor wafer

Abstract

Description

FIG. 1 is a front elevational view of hinge unit for vacuum-processing a semiconductor wafer, showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a rear elevational view thereof; and,

FIG. 6 is a left side elevational view thereof.

Claims

The ornamental design for a hinge unit for vacuum-processing a semiconductor wafer, as shown.