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The ornamental design for a soldering and desoldering tool, as shown and described. |
FIG. 1 is a perspective view of the soldering and desoldering tool with the arm in a lowered positioned;
FIG. 2 is a right side view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a front view thereof;
FIG. 7 is a rear view thereof; and,
FIG. 8 is a perspective view of the soldering and desoldering tool with the arm in a raised position.
Patent | Priority | Assignee | Title |
D644675, | Apr 28 2011 | VENUS CONCEPT INC | Housing for a robotic end effector |
D654106, | Oct 09 2009 | SIEMENS SCHWEIZ AG | Large stroke actuator |
D654523, | Oct 09 2009 | SIEMENS SCHWEIZ AG | Large stroke actuator |
D654941, | Oct 09 2009 | SIEMENS SCHWEIZ AG | Large stroke actuator |
D659731, | Oct 09 2009 | SIEMENS SCHWEIZ AG | Large stroke actuator |
D841066, | Nov 29 2017 | Hakko Corporation | Desktop soldering robot |
Patent | Priority | Assignee | Title |
4230250, | Apr 30 1979 | AUTOMATED PRODUCTION EQUIPMENT CORP M | Solder extractor |
4289953, | Feb 09 1979 | AUTOMATED PRODUCTION EQUIPMENT CORP M | Electrically heated solder extractor |
4569473, | Nov 03 1983 | Apparatus for and method of desoldering and removing an integrated circuit from a mounting member and for cleaning the same | |
4659004, | Feb 24 1984 | PACE, INCORPORATED, A CORP OF MARYLAND | Device for attaching modular electronic components to or removing them from an insulative device |
4752025, | May 22 1987 | Austin American Technology | Surface mount assembly repair terminal |
4767047, | Feb 01 1986 | GENERAL ELECTRIC COMPANY, P L C , THE, 1 STANHOPE GATE, LONDON W1A 1EH UNITED KINGDOM | Desoldering device |
4799617, | Oct 09 1987 | Advanced Techniques Co., Inc. | Convection heat attachment and removal instrument for surface mounted assemblies |
4832249, | Jul 03 1986 | Telefunken Systemtechnik GmbH | Method and arrangement for reflow soldering and reflow unsoldering of circuit boards |
5340011, | Dec 09 1992 | LSI LOGIC CORPORATTION | Adjustable height work holder for bonding semiconductor dies |
5419481, | Sep 21 1993 | Air-Vac Engineering Company, Inc. | Process and apparatus for attaching/deataching land grid array components |
5560531, | Dec 14 1994 | Delaware Capital Formation, Inc | Reflow minioven for electrical component |
5598965, | Nov 03 1994 | Integrated circuit, electronic component chip removal and replacement system | |
D282077, | Nov 26 1982 | Hitachi, Ltd. | Industrial robot |
D293324, | Jul 17 1985 | Hitachi, Ltd. | Industrial robot |
D410660, | Jun 19 1998 | Janome Sewing Machine Co., Ltd. | Industrial robot |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 22 1999 | Metcal, Inc. | (assignment on the face of the patent) | / | |||
Apr 06 1999 | ABED, TARK | METCAL, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009936 | /0068 | |
Apr 06 1999 | HANNA, SHAWN | METCAL, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009936 | /0068 | |
Mar 01 2001 | METCAL, INC, | DOVER TECHNOLGIES INTERNATIONAL, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011590 | /0772 | |
Mar 07 2001 | DOVER TECHNOLOGIES INTERNATIONAL, INC | Delaware Capital Formation, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011682 | /0668 | |
Apr 19 2002 | METCAL, INC | Delaware Capital Formation, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012852 | /0522 |
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