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The ornamental design for a device housing, as shown and described. |
FIG. 1 is a front and right side perspective view of a device housing illustrating a new design;
FIG. 2 is a left side view thereof;
FIG. 3 is a right side view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a front and right side perspective view of an alternate embodiment thereof;
FIG. 8 is a left side view of an alternate embodiment thereof; and,
FIG. 9 is a right side view of an alternate embodiment thereof.
The undisclosed views of the second embodiment are identical to those shown in the first embodiment.
Leverault, Craig M., Dann, Michael, Masuda, Kuni
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 09 1999 | Sun Microsystems, Inc. | (assignment on the face of the patent) | / | |||
May 21 1999 | LEVERAULT, CRAIG | Sun Microsystems, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010695 | /0783 | |
May 24 1999 | MASUDA, KUNI | Sun Microsystems, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010695 | /0783 | |
Jun 07 1999 | DANN, MICHAEL | Sun Microsystems, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010695 | /0783 |
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