|
The ornamental design for a process chamber lid, as shown and described. |
FIG. 1 is a top perspective view of a process chamber lid showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a side elevational view thereof;
FIG. 4 is an opposite side elevational view thereof;
FIG. 5 is an enlarged end elevational view thereof;
FIG. 6 is an enlarged opposite end elevational view thereof; and,
FIG. 7 is a bottom plan view thereof.
Patent | Priority | Assignee | Title |
10262834, | Oct 13 2009 | Lam Research Corporation | Edge-clamped and mechanically fastened inner electrode of showerhead electrode assembly |
8161906, | Jul 07 2008 | Lam Research Corporation | Clamped showerhead electrode assembly |
8206506, | Jul 07 2008 | Lam Research Corporation | Showerhead electrode |
8221582, | Jul 07 2008 | Lam Research Corporation | Clamped monolithic showerhead electrode |
8272346, | Apr 10 2009 | Lam Research Corporation | Gasket with positioning feature for clamped monolithic showerhead electrode |
8313805, | Jul 07 2008 | Lam Research Corporation | Clamped showerhead electrode assembly |
8402918, | Apr 07 2009 | Lam Research Corporation | Showerhead electrode with centering feature |
8414719, | Jul 07 2008 | Lam Research Corporation | Clamped monolithic showerhead electrode |
8419959, | Sep 18 2009 | Lam Research Corporation | Clamped monolithic showerhead electrode |
8536071, | Apr 10 2009 | Lam Research Corporation | Gasket with positioning feature for clamped monolithic showerhead electrode |
8573152, | Sep 03 2010 | Lam Research Corporation | Showerhead electrode |
8796153, | Jul 07 2008 | Lam Research Corporation | Clamped monolithic showerhead electrode |
9245716, | Oct 13 2009 | Lam Research Corporation | Edge-clamped and mechanically fastened inner electrode of showerhead electrode assembly |
D682199, | Jul 12 2012 | Microsoft Mobile Oy | Charger |
D938373, | Oct 25 2019 | Applied Materials, Inc | Substrate transfer structure |
Patent | Priority | Assignee | Title |
4405435, | Aug 27 1980 | Hitachi, Ltd.; Anelva Corporation | Apparatus for performing continuous treatment in vacuum |
4498416, | Jan 27 1981 | RIBER | Installation for treatment of materials for the production of semi-conductors |
4592306, | Dec 05 1983 | Pilkington Brothers P.L.C. | Apparatus for the deposition of multi-layer coatings |
4607593, | Dec 23 1983 | U S PHILIPS CORPORATION, A DE CORP | Apparatus for processing articles in a controlled environment |
4664062, | Oct 31 1984 | Hitachi, Ltd. | Apparatus for manufacturing semiconductors |
4681773, | Mar 27 1981 | American Telephone and Telegraph Company AT&T Bell Laboratories | Apparatus for simultaneous molecular beam deposition on a plurality of substrates |
4709655, | Dec 03 1985 | Novellus Systems, Inc | Chemical vapor deposition apparatus |
4715921, | Oct 24 1986 | Applied Materials, Inc | Quad processor |
4717461, | Sep 15 1986 | SOLITEC WAFER PROCESSING INC | System and method for processing workpieces |
4733631, | Sep 30 1986 | Denton Vacuum, Inc. | Apparatus for coating substrate devices |
4739787, | Nov 10 1986 | RUSHMORE TECHNOLOGY INC | Method and apparatus for improving the yield of integrated circuit devices |
4820106, | May 16 1987 | BALZERS UND LEYBOLD DEUTSCHLAND HOLDING AKTIENGESELLSCHAFT | Apparatus for passing workpieces into and out of a coating chamber through locks |
4825808, | Dec 19 1986 | Anelva Corporation | Substrate processing apparatus |
4857160, | Jul 25 1988 | OERLIKON-BUHRLE U S A INC , A DE CORP | High vacuum processing system and method |
4886592, | Oct 17 1987 | Singulus Technologies GmbH | Apparatus on the carousel principle for coating substrates |
4917556, | Apr 28 1986 | Varian Semiconductor Equipment Associates, Inc | Modular wafer transport and processing system |
4951601, | Dec 19 1986 | Applied Materials, Inc. | Multi-chamber integrated process system |
5000113, | Dec 19 1986 | Applied Materials, Inc | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process |
5067218, | May 21 1990 | Freescale Semiconductor, Inc | Vacuum wafer transport and processing system and method using a plurality of wafer transport arms |
5088444, | Mar 15 1989 | Kabushiki Kaisha Toshiba | Vapor deposition system |
5186718, | May 19 1989 | Applied Materials, Inc. | Staged-vacuum wafer processing system and method |
5199483, | May 15 1991 | Applied Materials, Inc.; APPLIED MATERIALS, INC A CORP OF DELAWARE | Method and apparatus for cooling wafers |
5259881, | May 17 1991 | Tokyo Electron Limited | Wafer processing cluster tool batch preheating and degassing apparatus |
5352248, | May 17 1991 | Tokyo Electron Limited | Pyrometer temperature measurement of plural wafers stacked on a processing chamber |
5380682, | May 17 1991 | Tokyo Electron Limited | Wafer processing cluster tool batch preheating and degassing method |
5516732, | Dec 04 1992 | Tokyo Electron Limited | Wafer processing machine vacuum front end method and apparatus |
5520002, | Feb 01 1995 | Sony Corporation; Sony Electronics, INC | High speed pump for a processing vacuum chamber |
5582866, | Jan 28 1993 | Applied Materials, Inc. | Single substrate vacuum processing apparatus having improved exhaust system |
5769952, | Jun 07 1994 | Tokyo Electron, Ltd. | Reduced pressure and normal pressure treatment apparatus |
5784238, | Aug 01 1996 | Applied Materials, Inc | Coordinated cluster tool energy delivery system |
5930456, | May 14 1998 | MATTSON THERMAL PRODUCTS, INC | Heating device for semiconductor wafers |
5944857, | May 08 1997 | Tokyo Electron Limited | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
6093252, | Aug 03 1995 | ASM America, Inc | Process chamber with inner support |
6110556, | Oct 17 1997 | Applied Materials, Inc. | Lid assembly for a process chamber employing asymmetric flow geometries |
EP756316A1, | |||
JP487782, | |||
JP487784, | |||
JP487785, | |||
JP60221572, | |||
JP61170568, | |||
JP61246381, | |||
JP62116769, | |||
JP62131455, | |||
JP62164875, | |||
WO8707309, |
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Mar 21 2000 | TODD, CRAIG B | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010738 | /0361 | |
Mar 21 2000 | YU, JAMES E | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010738 | /0361 |
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