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The ornamental design for a multi-effects signal processor, as shown and described. |
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FIG. 1 is a perspective view of a multi-effects signal processor.
FIG. 2 is a top plan view of the multi-effects signal processor of FIG. 1.
FIG. 3 is a bottom plan view of the multi-effects signal processor of FIG. 1.
FIG. 4 is a rear elevation view of the multi-effects signal processor of FIG. 1.
FIG. 5 is a front elevation view of the multi-effects signal processor of FIG. 1.
FIG. 6 is a left side elevation view of the multi-effects signal processor of FIG. 1; and,
FIG. 7 is a right elevation view of the multi-effects signal processor of FIG. 1.
The broken lines shown in FIGS. 1-4 and 6 are illustrative of environmental features only and form no part of the claimed design.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| May 21 2000 | BEHRINGER, ULRICH | RED CHIP COMPANY, LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010820 | /0610 | |
| May 26 2000 | Red Chip Company, Ltd. | (assignment on the face of the patent) | / |
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