Patent
   D447120
Priority
Sep 27 2000
Filed
Sep 27 2000
Issued
Aug 28 2001
Expiry
Aug 28 2015
Assg.orig
Entity
unknown
30
11
n/a
The ornamental design for a molded cable interconnect, as shown and described.

A portion of the disclosure of this design patent application document contains material to which a claim for copyright is also made. The copyright owner has no objection to the facsimile reproduction of this design patent application by anyone as it appears in the Patent and Trademark Office patent file or records, but reserves all other copyrights whatsoever.

FIG. 1 is a perspective view of a first embodiment of a molded cable interconnect, in accordance with the present invention.

FIG. 2 is a plan view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 3 is an underside view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 4 is a side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 5 is a corresponding side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1, as depicted in FIG. 1.

FIG. 6 is a rear view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 7 is a frontal view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 8 is a perspective view of a second embodiment of a molded cable interconnect, in accordance with the present invention.

FIG. 9 is a plan view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 10 is an underside view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 11 is a side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 12 is a corresponding side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 13 is a rear view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8; and,

FIG. 14 is a frontal view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

Lee, Kendrew

Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 27 2000Monster Cable Products, Inc.(assignment on the face of the patent)
Sep 27 2000LEE, KENDREWMonster Cable Products, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0111450138 pdf
Sep 27 2000LEE, KENDREWMonster Cable Products, INCRE-RECORD TO CORRECT THE CORRESPONDENCE ADDRESS, PREVIOUSLY RECORDED AT REEL 011145, FRAME 0138 0114800648 pdf
Feb 08 2001Monster Cable Products, INCIMPERIAL BANK, AS AGENTSECURITY AGREEMENT0116670124 pdf
Feb 08 2001LEE, NOELIMPERIAL BANK, AS AGENTSECURITY AGREEMENT0116670124 pdf
Aug 25 2006Monster Cable Products, INCCOMERICA BANKSECURITY AGREEMENT0181940771 pdf
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