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The ornamental design for the memory card adapter, as shown and described. |
FIG. 1 is a top, right isometric view of the invention, on an enlarged scale;
FIG. 2 is a bottom, left isometric view of the same, on an even greater enlarged scale,
FIG. 3 is a front elevational view of the same;
FIG. 4 is a right side elevational view of the same;
FIG. 5 is a left side elevational view of the same;
FIG. 6 is a rear elevational view of the same; and,
FIG. 7 is a bottom plan view of the same.
The broken line drawing in FIGS. 1, 2, 4, 5 and 7 is for illustrative purposes only and forms no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 22 2000 | SCM Microsystems, Inc. | (assignment on the face of the patent) | / | |||
Jul 10 2000 | LIN MING CHUN | SCM MICROSYSTEMS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011114 | /0556 | |
Oct 30 2012 | IDENTIVE GROUP, INC | HERCULES TECHNOLOGY GROWTH CAPITAL, INC | SECURITY AGREEMENT | 029217 | /0550 | |
Oct 30 2012 | HIRSCH ELECTRONICS LLC | HERCULES TECHNOLOGY GROWTH CAPITAL, INC | SECURITY AGREEMENT | 029217 | /0550 | |
Oct 30 2012 | ROCKWEST TECHNOLOGY GROUP, INC | HERCULES TECHNOLOGY GROWTH CAPITAL, INC | SECURITY AGREEMENT | 029217 | /0550 | |
Mar 31 2014 | HERCULES TECHNOLOGY GROWTH CAPITAL, INC | IDENTIVE GROUP, INC | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 032638 | /0354 | |
Mar 31 2014 | HERCULES TECHNOLOGY GROWTH CAPITAL, INC | HIRSCH ELECTRONICS LLC | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 032638 | /0354 | |
Mar 31 2014 | HERCULES TECHNOLOGY GROWTH CAPITAL, INC | ROCKWEST TECHNOLOGY GROUP, INC | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 032638 | /0354 |
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