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The ornamental design for a cover for electronics housing, as shown and described. |
FIG. 1 is a front perspective view of the cover for electronics housing showing my design;
FIG. 2 is a front view thereof;
FIG. 3 is a side view thereof;
FIG. 4 is an opposing side view thereof;
FIG. 5 is a bottom end view thereof;
FIG. 6 is a top end view thereof;
FIG. 7 is a front perspective view of an alternate embodiment of my design;
FIG. 8 is a front view thereof;
FIG. 9 is a side view thereof;
FIG. 10 is an opposing side view thereof;
FIG. 11 is a bottom end view thereof; and,
FIG. 12 is a top end view thereof.
The rear view of the cover for electronics housing is disclaimed as lacking ornamentality for both embodiments.
The broken lines shown herein are for illustrative purposes only and form no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 06 2000 | SMITH, DWIGHT DAVID | TELEFONAKTIEBOLAGET L M ERICSSON | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011154 | /0601 | |
Oct 09 2000 | Telefonaktiebolaget L.M. Ericsson | (assignment on the face of the patent) | / |
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