|
The ornamental design for a vacuum processing equipment configuration, as shown and described.
|
FIG. 1 is front, top and left side perspective view of cassettes storage eguipment in relation to a conveyor equipped robot and load and unload chambers showing our new design;
FIG. 2 is a top plan view;
FIG. 3 is a front side elevational view;
FIG. 4 is a right side elevational view;
FIG. 5 is a rear side elevational view;
FIG. 6 is a left side elevational view;
FIG. 7 is a bottom plan view; and,
FIG. 8 is a right side elevational view along line 8--8 of FIG. 2.
The details shown in broken lines in all views is for illustrative purposes only and form no part of the claimed design.
Kato, Shigekazu, Nishihata, Kouji, Tsubone, Tsunehiko, Itou, Atsushi
Patent | Priority | Assignee | Title |
D650344, | Oct 20 2008 | Ebara Corporation | Vacuum contact pad |
D818226, | Dec 03 2015 | LG Electronics Inc. | Robot vacuum cleaner |
D828660, | Jun 08 2016 | LG Electronics Inc. | Robot vacuum cleaner |
D840618, | Nov 30 2016 | LG Electronics Inc. | Robot for cleaning |
D840619, | Nov 23 2016 | LG Electronics Inc. | Robot for cleaning |
D840620, | Nov 18 2016 | LG Electronics Inc. | Robot for cleaning |
D877994, | Jan 12 2018 | LG Electronics Inc. | Robot for cleaning |
D901110, | Nov 08 2018 | BEIJING XIAOMI MOBILE SOFTWARE CO , LTD | Robot cleaner |
D929690, | Mar 18 2019 | BEIJING XIAOMI MOBILE SOFTWARE CO., LTD. | Sweeper |
D936719, | Feb 20 2019 | LG Electronics Inc | Home hub robot |
D940771, | Aug 15 2019 | BEIJING XIAOMI MOBILE SOFTWARE CO , LTD | Robot vacuum cleaner |
D971530, | Mar 06 2019 | CLEANBOX TECHNOLOGY, INC | Cleaning device |
Patent | Priority | Assignee | Title |
3652444, | |||
3981791, | Mar 10 1975 | Signetics Corporation | Vacuum sputtering apparatus |
4138306, | Aug 31 1976 | Tokyo Shibaura Electric Co., Ltd. | Apparatus for the treatment of semiconductors |
4226897, | Dec 05 1977 | Plasma Physics Corporation | Method of forming semiconducting materials and barriers |
4311427, | Dec 21 1979 | Novellus Systems, Inc | Wafer transfer system |
4313783, | May 19 1980 | Branson International Plasma Corporation | Computer controlled system for processing semiconductor wafers |
4313815, | Apr 07 1978 | Novellus Systems, Inc | Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor |
4318767, | Nov 27 1979 | Tokyo Ohka Kogyo Kabushiki Kaisha | Apparatus for the treatment of semiconductor wafers by plasma reaction |
4449885, | May 24 1982 | Varian Semiconductor Equipment Associates, Inc | Wafer transfer system |
4457661, | Dec 07 1981 | Applied Materials, Inc. | Wafer loading apparatus |
4534314, | May 10 1984 | Varian Associates, Inc. | Load lock pumping mechanism |
4563240, | Aug 10 1983 | Hitachi, LTD | Method and apparatus for plasma process |
4576698, | Jun 30 1983 | International Business Machines Corporation | Plasma etch cleaning in low pressure chemical vapor deposition systems |
4634331, | May 24 1982 | Varian Semiconductor Equipment Associates, Inc | Wafer transfer system |
4705951, | Apr 17 1986 | Varian Associates, Inc. | Wafer processing system |
4715764, | Apr 28 1986 | Varian Semiconductor Equipment Associates, Inc | Gate valve for wafer processing system |
4836733, | Apr 28 1986 | Varian Semiconductor Equipment Associates, Inc | Wafer transfer system |
4836905, | Jul 16 1987 | Texas Instruments Incorporated | Processing apparatus |
4851101, | Sep 18 1987 | Novellus Systems, Inc | Sputter module for modular wafer processing machine |
4895107, | Jul 06 1987 | Kabushiki Kaisha Toshiba | Photo chemical reaction apparatus |
4902934, | May 10 1988 | Sumitomo Metal Industries, Ltd. | Plasma apparatus |
4903937, | Sep 24 1987 | Varian Semiconductor Equipment Associates, Inc | Isolation valve for vacuum and non-vacuum application |
4909695, | Apr 04 1986 | Tokyo Electron Limited | Method and apparatus for handling and processing wafer-like materials |
4911597, | Jan 22 1985 | Applied Materials, Inc. | Semiconductor processing system with robotic autoloader and load lock |
4915564, | Apr 04 1986 | Tokyo Electron Limited | Method and apparatus for handling and processing wafer-like materials |
4917556, | Apr 28 1986 | Varian Semiconductor Equipment Associates, Inc | Modular wafer transport and processing system |
4924890, | May 16 1986 | Eastman Kodak Company | Method and apparatus for cleaning semiconductor wafers |
4936329, | Feb 08 1989 | LEYBOLD AKTIENGESELLSCHAFT, A GERMAN CORP | Device for cleaning, testing and sorting of workpieces |
4951601, | Dec 19 1986 | Applied Materials, Inc. | Multi-chamber integrated process system |
4969790, | Aug 12 1987 | Leybold Aktiengesellschaft | Apparatus on the carousel principle for the coating of substrates |
5007981, | Feb 27 1989 | Hitachi, Ltd. | Method of removing residual corrosive compounds by plasma etching followed by washing |
5014217, | Feb 09 1989 | S C Technology, Inc. | Apparatus and method for automatically identifying chemical species within a plasma reactor environment |
5292393, | Dec 19 1986 | Applied Materials, Inc. | Multichamber integrated process system |
5351415, | May 18 1992 | Convey, Inc. | Method and apparatus for maintaining clean articles |
5452166, | Oct 01 1993 | Applied Magnetics Corporation | Thin film magnetic recording head for minimizing undershoots and a method for manufacturing the same |
5462397, | Mar 16 1993 | Tokyo Electron Limited | Processing apparatus |
5504033, | Aug 26 1992 | Intersil Corporation | Method for forming recessed oxide isolation containing deep and shallow trenches |
5504347, | Oct 17 1994 | Raytheon Company | Lateral resonant tunneling device having gate electrode aligned with tunneling barriers |
5509771, | Jul 29 1992 | Tokyo Electron Limited | Vacuum processing apparatus |
5556714, | Aug 28 1989 | Hitachi, Ltd. | Method of treating samples |
5651858, | Mar 06 1995 | Motorola Inc. | Method for forming a tapered opening in silicon |
5675461, | Aug 14 1995 | Applied Magnetics Corporation | Thin film magnetic recording head for minimizing undershoots |
5685684, | Nov 26 1990 | Hitachi, Ltd. | Vacuum processing system |
EP246453, | |||
EP381338, | |||
JP1135015, | |||
JP1251734, | |||
JP1298180, | |||
JP1310553, | |||
JP131970, | |||
JP131971, | |||
JP2106037, | |||
JP261064, | |||
JP265252, | |||
JP294647, | |||
JP430549, | |||
JP5729577, | |||
JP60246635, | |||
JP62207866, | |||
JP6244571, | |||
JP6250463, | |||
JP6289881, | |||
JP63153270, | |||
JP636582, | |||
JP6412037, | |||
WO8707309, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 12 1999 | Hitachi, Ltd. | (assignment on the face of the patent) | / | |||
Oct 29 2001 | KATO, SHIGEKAZU | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012301 | /0459 | |
Oct 29 2001 | NISHIHATA, KOUJI | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012301 | /0459 | |
Oct 29 2001 | TSUBONE, TSUNEHIKO | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012301 | /0459 | |
Oct 29 2001 | ITOU, ATSUSHI | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012301 | /0459 |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |