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The ornamental design for a clip for attaching heatsinks, as shown and described.
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FIG. 1 is a right front perspective view of an embodiment of the clip for attaching heatsinks, showing the lever arm in an open position.
FIG. 2 is a rear elevation of the embodiment of FIG. 1.
FIG. 3 is a bottom plan of the embodiment of FIG. 1.
FIG. 4 is a left side elevation of the embodiment of FIG. 1.
FIG. 5 is a right front perspective showing the embodiment of FIG. 1 with its lever arm in a closed position, and a representative heatsink; and,
FIG. 6 is a front elevation of the embodiment and the heatsink shown in FIG. 5.
The components shown in phantom in FIGS. 5 and 6 do not form a part of the present invention.
Shah, Ketan R., Kozyra, Kazimierz L.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 31 2000 | Intel Corporation | (assignment on the face of the patent) | / | |||
May 31 2000 | KOZYRA KAZIMIERZ L | Intel Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010842 | /0457 | |
May 31 2000 | SHAH KETAN R | Intel Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010842 | /0457 |
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