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The ornamental design for a retractable headset housing, as shown and described.
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FIG. 1 is an isometric view of the retractable headset housing showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines in FIG. 1, showing the earphone/headset and the coiled phone jack cord are for illustrative purposes only and form no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 23 2001 | FSL Electronics Pty Ltd. | (assignment on the face of the patent) | / | |||
Jan 25 2002 | KIM, SEOK-KI | FSL ELECTRONICS PTY LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012392 | /0660 |
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