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The ornamental design for chip for personal digital assistant, as shown and described.
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FIG. 1 is a front perspective view of a chip for personal digital assistant according to the present invention;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a front perspective view of a chip for personal digital assistant according to the present invention, connected to a personal digital assistant;
FIG. 6 is a right elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.
The broken line showing of a personal digital assistant is for illustrative purposes only and forms no part of the claimed design.
Hawkins, Jeffrey C., Skillman, Peter, Bone, Martin
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Mar 29 2001 | BONE, MARTIN | HANDSPRING, INC , A DELAWARE CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011698 | /0078 | |
Apr 03 2001 | SKILLMAN, PETER | HANDSPRING, INC , A DELAWARE CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011698 | /0078 | |
Apr 03 2001 | HAWKINS, JEFFREY C | HANDSPRING, INC , A DELAWARE CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011698 | /0078 | |
Apr 05 2001 | Handspring, Inc. | (assignment on the face of the patent) | / | |||
Jun 04 2003 | HANDSPRING, INC | Palm, Inc | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 013705 | /0623 | |
Oct 24 2007 | Palm, Inc | JPMORGAN CHASE BANK, N A | SECURITY AGREEMENT | 020317 | /0256 | |
Jul 01 2010 | JPMORGAN CHASE BANK, N A , AS ADMINISTRATIVE AGENT | Palm, Inc | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 024630 | /0474 | |
Oct 27 2010 | Palm, Inc | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025204 | /0809 | |
Apr 30 2013 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030341 | /0459 | |
Dec 18 2013 | Palm, Inc | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031837 | /0239 | |
Dec 18 2013 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031837 | /0544 | |
Jan 23 2014 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032177 | /0210 | |
Jan 23 2014 | Hewlett-Packard Company | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032177 | /0210 | |
Jan 23 2014 | Palm, Inc | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032177 | /0210 |
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