Patent
   D458907
Priority
Jan 24 2001
Filed
Jan 24 2001
Issued
Jun 18 2002
Expiry
Jun 18 2016
Assg.orig
Entity
unknown
4
11
n/a
The ornamental design for a semiconductor element, as shown and described.

FIG. 1 is a perspective view of a semiconductor element showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Morimiya, Yuji

Patent Priority Assignee Title
D479208, Aug 07 2002 Sony Corporation Antenna for wireless communication
D486814, Feb 04 2003 Sony Corporation Portable hard disc recorder
D504691, May 19 2004 Sony Corporation Hard disc player
D511344, Apr 20 2004 Sony Corporation Portable hard disc drive
Patent Priority Assignee Title
5548485, Sep 29 1995 ITT Corporation IC card rigidized cover
6166913, Jul 11 1997 Hon Hai Precision Ind. Co., Ltd. Casing for PC card
D298327, Oct 16 1985 Mitsubishi Denki Kabushiki Kaisha Memory card for a computer system
D356291, Oct 12 1992 TDK-Lambda Corporation DC stabilizing power supply
D375937, Dec 01 1995 Qualcomm Incorporated Wireless local loop power supply
D376133, Dec 08 1992 International Business Machines Corp Jacketed circuit card
D379350, Aug 10 1993 International Business Machines Corporation Expanded jacketted circuit card
D421597, Apr 24 1998 Sony Corporation Semiconductor element
D421967, Aug 06 1997 Sony Corporation Semiconductor element
D427159, Jun 27 1997 Sony Corporation Semiconductor element
D432505, Aug 06 1997 Sony Corporation Semiconductor element
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 15 2001MORIMIYA, YUJISony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0114980200 pdf
Jan 24 2001Sony Corporation(assignment on the face of the patent)
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