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The ornamental design for an enclosure for electronic circuitry, as shown and described.
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FIG. 1 is a front isometric view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a left side view of the present invention;
FIG. 4 is a right view of the present invention;
FIG. 5 is a rear view of the present invention;
FIG. 6 is a bottom view of the present invention; and,
FIG. 7 is a rear isometric view of the present invention.
Oakley, Nicholas W., Smith, Mark S.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Sep 13 2000 | OAKLEY, NICHOLAS W | 3Com Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011104 | /0543 | |
| Sep 21 2000 | 3Com Corporation | (assignment on the face of the patent) | / | |||
| Jan 10 2001 | SMITH, MARK S | 3Com Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011576 | /0863 | |
| Jan 31 2003 | Hewlett-Packard Company | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027329 | /0044 | |
| Apr 28 2010 | 3Com Corporation | Hewlett-Packard Company | MERGER SEE DOCUMENT FOR DETAILS | 024630 | /0820 | |
| Apr 28 2010 | 3Com Corporation | Hewlett-Packard Company | CORRECTIVE ASSIGNMENT TO CORRECT THE SEE ATTACHED | 025039 | /0844 | |
| Oct 10 2011 | Hewlett-Packard Company | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | CORRECTIVE ASSIGNMENT PREVIUOSLY RECORDED ON REEL 027329 FRAME 0001 AND 0044 | 028911 | /0846 | |
| Oct 27 2015 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Hewlett Packard Enterprise Development LP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 037079 | /0001 |
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