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The ornamental design for a power supply, as shown and described.
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FIG. 1 is a front perspective view from above of a power supply, showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a rear side view thereof.
Patent | Priority | Assignee | Title |
10218265, | Nov 09 2010 | TDK-Lambda Corporation | State space-based multi-level voltage regulator system |
8934267, | Nov 09 2010 | TDK-Lambda Corporation | Loosely regulated feedback control for high efficiency isolated DC-DC converters |
9143047, | Nov 09 2010 | TDK-Lambda Corporation | Loosely regulated feedback control for high efficiency isolated DC-DC converters |
9520772, | Nov 09 2010 | TDK-Lambda Corporation | Multi-level voltage regulator system |
D494539, | Oct 28 2002 | TDK-Lambda Corporation | Power converter |
D495295, | Oct 23 2002 | TDK-Lambda Corporation | Power supply |
Patent | Priority | Assignee | Title |
5418688, | Mar 29 1993 | Motorola, Inc. | Cardlike electronic device |
5812387, | Feb 21 1997 | BEL POWER SOLUTIONS INC | Multi-deck power converter module |
5835350, | Dec 23 1996 | Lineage Power Corporation | Encapsulated, board-mountable power supply and method of manufacture therefor |
5926373, | Dec 23 1996 | Lineage Power Corporation | Encapsulated, board-mountable power supply and method of manufacture |
5933343, | Feb 21 1997 | Power-One, Inc | Multi-deck power converter module |
6005773, | Dec 23 1996 | Lineage Power Corporation | Board-mountable power supply module |
6144557, | Apr 09 1999 | ABB POWER ELECTRONICS INC | Self-locking conductive pin for printed wiring substrate electronics case |
6166464, | Aug 24 1998 | ASBU Holdings, LLC | Power module |
6189203, | Apr 08 1999 | ABB POWER ELECTRONICS INC | Method of manufacturing a surface mountable power supply module |
6317324, | Feb 01 2000 | Lineage Power Corporation | Encapsulated power supply with a high thermal conductivity molded insert |
20010040812, |
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Mar 08 2002 | TOMIOKA, SATOSHI | Densei-Lambda Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012732 | /0085 | |
Mar 22 2002 | Densei-Lambda Kabushiki Kaisha | (assignment on the face of the patent) | / | |||
Oct 02 2008 | DENSEI-LAMBDA K K | TDK-Lambda Corporation | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 022288 | /0151 |
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