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The ornamental design for a high performance cooling device, as shown and described.
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FIG. 1 is a top front left perspective view of a first embodiment of a high performance cooling device showing my new design;
FIG. 2 is a left elevation view thereof;
FIG. 3 is a right elevation view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a top front left perspective view of a second embodiment of a high performance cooling device showing my new design;
FIG. 7 is a top front right perspective view
FIG. 8 is a left elevation view thereof;
FIG. 9 is a right elevation view thereof;
FIG. 10 is a bottom view thereof; and,
FIG. 11 is a top plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 27 2001 | Hewlett Packard Company | (assignment on the face of the patent) | / | |||
Jul 27 2001 | HEGDE, SHANKAR | Hewlett-Packard Company | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012410 | /0457 | |
Jan 31 2003 | Hewlett-Packard Company | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 026909 | /0208 |
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