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The ornamental design for a communications panel, as shown and described.
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FIG. 1 is a perspective view of one embodiment.
FIG. 2 is a front elevation view of the embodiment of FIG. 1.
FIG. 3 is a top plan view of the embodiment of FIG. 1.
FIG. 4 is a bottom plan view of the embodiment of FIG. 1.
FIG. 5 is a right side elevation view of the embodiment of FIG. 1.
FIG. 6 is a left side elevation view of the embodiment of FIG. 1.
FIG. 7 is a rear elevation view of the embodiment of FIG. 1.
FIG. 8 is a perspective view of a second embodiment.
FIG. 9 is a front elevation view of the embodiment of FIG. 8.
FIG. 10 is a top plan view of the embodiment of FIG. 8.
FIG. 11 is a bottom plan view of the embodiment of FIG. 8.
FIG. 12 is a right side elevation view of the embodiment of FIG. 8.
FIG. 13 is a left side elevation view of the embodiment of FIG. 8; and,
FIG. 14 is a rear elevation view of the embodiment of FIG. 8.
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Sep 30 2011 | ADC Telecommunications, Inc | TYCO ELECTRONICS SERVICES GmbH | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 036060 | /0174 | |
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