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The ornamental design for an interphone, as shown and described.
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FIG. 1 is a perspective view of the interphone showing our new design;
FIG. 2 is a front elevational view of the interphone of FIG.1;
FIG. 3 is a left side elevationa lview of the interphone shown in FIG. 1;
FIG. 4 is a right side elevational view of the interphone of FIG. 1;
FIG. 5 is a rear elevational view of the interphone of FIG. 1;
FIG. 6 is a top plan view of the interphone of FIG. 1; and,
FIG. 7 a bottom plan view of the interphone of FIG. 1.
Matsui, Hiroshi, Hotta, Toshio
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Sep 25 2001 | MATSUI, HIROSHI | AIPHONE CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012220 | /0043 | |
| Sep 25 2001 | HOTTA, TOSHIO | AIPHONE CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012220 | /0043 | |
| Oct 01 2001 | Aiphone Co., Ltd. | (assignment on the face of the patent) | / |
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