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The ornamental design for a module for locating system, as shown and described.
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FIG. 1 is a perspective view of a module for locating system showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
FIG. 8 is a second embodiment perspective view of a module for locating system showing our new design;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a left side elevational view thereof;
FIG. 12 is a right side elevational view thereof;
FIG. 13 is a top plan view thereof; and,
FIG. 14 is a bottom plan view thereof.
Hayashida, Masato, Teranishi, Koichiro, Ogaki, Tadao, Kitamura, Takaaki, Amagasu, Masami
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Oct 24 2001 | Sony Corporation | (assignment on the face of the patent) | / | |||
| Jan 11 2002 | KITAMURA, TAKAAKI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012562 | /0142 | |
| Jan 22 2002 | OGAKI, TADAO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012562 | /0142 | |
| Jan 25 2002 | TERANISHI, KOICHIRO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012562 | /0142 | |
| Jan 29 2002 | HAYASHIDA, MASATO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012562 | /0142 | |
| Jan 29 2002 | AMAGASU, MASAMI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012562 | /0142 |
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