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The ornamental design for a communications module, as shown and described.
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FIG. 1 is a top, front, left side perspective view of a communications module showing our new design;
FIG. 2 is a top, rear, left side perspective view thereof;
FIG. 3 is a bottom, front, right side perspective view thereof;
FIG. 4 is a bottom, rear, right side perspective view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a front elevation view thereof;
FIG. 7 is a rear elevation view thereof;
FIG. 8 is a right side elevation view thereof; and,
FIG. 9 is a left side elevation view thereof.
Laity, Ian A., Smither, Michael R.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 25 2000 | Intel Corporation | (assignment on the face of the patent) | / | |||
Oct 12 2000 | SMITHER, MICHAEL R | XIRCOM, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011235 | /0551 | |
Oct 25 2000 | LAITY, IAN A | XIRCOM, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011235 | /0551 | |
Jun 13 2002 | XIRCOM, INC | Intel Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013160 | /0195 |
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