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The ornamental design for a high performance cooling device, as shown and described.
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FIG. 1 is a top front left perspective view of a first embodiment of a high performance cooling device showing my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a right elevation view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a top front left perspective view of a second embodiment of a high performance cooling device showing my new design;
FIG. 7 is a front elevation view thereof;
FIG. 8 is a right elevation view thereof;
FIG. 9 is a bottom view thereof; and,
FIG. 10 is a top plan view thereof.
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Jul 28 2003 | Hewlett-Packard Company | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013862 | /0623 |
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