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The ornamental design for a portion of a modem, as shown and described.
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FIG. 1 is a top, front and right side perspective view of a portion of a modem showing my new design,
FIG. 2 is a front elevational view thereof,
FIG. 3 is a top plan view thereof,
FIG. 4 is a bottom plan view thereof,
FIG. 5 is a rear elevational view thereof,
FIG. 6 is a left side elevational view thereof, and,
FIG. 7 is a right side elevational view thereof.
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| Dec 11 2001 | TANAKA, KEITA | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012441 | /0755 | |
| Jan 04 2002 | Kabushiki Kaisha Toshiba | (assignment on the face of the patent) | / |
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