Patent
   D473852
Priority
May 20 2002
Filed
May 20 2002
Issued
Apr 29 2003
Expiry
Apr 29 2017
Assg.orig
Entity
unknown
3
8
n/a
The ornamental design for a face panel for a HPCI board, as shown and described.

The design consists of the ornamental shape of a face panel for a HPCI board of a computer system. The face panel is the portion of the HPCI board that remains visible after the HPCI boards is fully inserted into a slot of a computer system. Surfaces behind the face panel are not a part of the design.

FIG. 1 is a perspective view of the face panel for a HPCI board with the swiveling handle in a folded position, viewed from a position to the left of the face panel.

FIG. 2 is a plan view of the face panel for a HPCI board with the swiveling handle in a folded position.

FIG. 3 is a perspective view of the face panel for a HPCI board with swiveling handle in a folded position, viewed from a position to the right of the face panel.

FIG. 4 is a perspective view of the face panel for a HPCI board with the swiveling handle in an extended position, viewed from a position to the left of the face panel.

FIG. 5 is a plan view of the face panel for a HPCI board with the swiveling handle in an extended position; and,

FIG. 6 is a perspective view of the face panel for a HPCI board with the swiveling handle in an extended position, viewed from a position to the right of the face panel.

Richardson, Adam, Frank, Christopher H.

Patent Priority Assignee Title
D545321, Sep 09 2005 Sun Microsystems, Inc Drive bracket
D556204, May 16 2006 Sun Microsystems, Inc. Filler panel with integrated dust cover
D770398, Aug 07 2014 EPISTAR CORPORATION Light emitting diode filament
Patent Priority Assignee Title
5708552, Nov 14 1995 Electronics and Telecommunications Research Institute; Korea Telecommunication Authority Electrostatic discharge protection guide rail system for printed circuit board
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6067225, Aug 04 1997 Sun Microsystems, Inc Disk drive bracket
6080930, May 27 1998 RPX CLEARINGHOUSE LLC ESD/EMC gasket
6304456, Jul 22 1999 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Housing assembly having simplified circuit board assembly, retention, and electrical connection features
6370035, Dec 27 1999 WSOU Investments, LLC Electronic circuit pack and shelf and electronic circuit pack combinations
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D415116, May 16 1997 Telefonaktiebolaget LM Ericsson Front panel for circuit card
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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 20 2002Sun Microsystems, Inc.(assignment on the face of the patent)
Jul 29 2002FRANK, CHRISTOPHER H Sun Microsystems, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0132460323 pdf
Aug 01 2002RICHARDSON, ADAMSun Microsystems, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0132460323 pdf
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