Patent
   D474212
Priority
Mar 19 2002
Filed
Mar 19 2002
Issued
May 06 2003
Expiry
May 06 2017
Assg.orig
Entity
unknown
10
3
n/a
The ornamental design for a polisher, as shown and described.

FIG. 1 is a perspective view of one embodiment of the subject polisher.

FIG. 2 is an elevated front view of the embodiment depicted in FIG. 1.

FIG. 3 is an elevated side view of one side of the embodiment depicted in FIG. 1, the other side being substantially similar.

FIG. 4 is an overhead plan view of the embodiment depicted in FIG. 1.

FIG. 5 is an elevated rear view of the embodiment depicted in FIG. 1; and,

FIG. 6 is a bottom plan view of the embodiment depicted in FIG. 1.

The broken line showing is for illustrative purposes only and forms no part of the claimed design.

Domaille, Michael D., Domaille, Nancy J., Ford, Harold M., Flanders, Dennis G., Hewitt, Ian

Patent Priority Assignee Title
11458588, Jul 30 2019 Domaille Engineering, LLC Optical fiber polishing fixture
11618125, Jul 30 2019 Domaille Engineering, LLC Method of connecting a ferrule to an optical fiber polishing fixture assembly
8708776, Dec 04 2008 Domaille Engineering, LLC Optical fiber polishing machines, fixtures and methods
9759872, Feb 19 2016 Domaille Engineering, LLC Optical fiber polishing fixture
D585914, Jun 20 2008 Illinois Tool Works Inc Grinder/polisher
D595317, Oct 24 2007 THW ENGINEERING B V Polishing machine
D673591, May 18 2012 Venmill Industries Incorporated Optical disc restoration machine
D673985, May 18 2012 Venmill Industries Incorporated Optical disc restoration machine with door open
D719989, Mar 07 2014 Venmill Industries Incorporated Optical disc sanding machine with top lid open
D724634, Mar 07 2014 Venmill Industries Incorporated Optical disc sanding machine
Patent Priority Assignee Title
5136820, May 30 1991 SIECOR TECHNOLOGY, INC Polishing method
5480344, Oct 01 1991 The Furukawa Electric Co., Ltd. Polishing process for optical connector assembly with optical fiber and polishing apparatus
6042454, Jun 04 1997 Ebara Corporation System for detecting the endpoint of the polishing of a semiconductor wafer by a semiconductor wafer polisher
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