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			   The ornamental design for an optical sub-assembly module, as shown and described.     
    
    
    
    
    
    
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FIG. 1 is a front elevational view of an optical sub-assembly module showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a perspective view thereof.
Hung, Tuan-Yu, Li, Chang-You, Chiang, Ling-Ying, Hsieh, Wen-Chih, Ho, Ing-Jer
| Patent | Priority | Assignee | Title | 
| 6299467, | Apr 18 2000 | ADVANCED CONNECTECK INC ; Advanced Connectek, Inc | Electrical connector | 
| D330006, | Apr 05 1990 | SUMITOMO ELECTRIC INDUSTRIES, LTD , 5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA, JAPAN | Optical receiver/transmitter module | 
| D355406, | Mar 09 1992 | TII Industries Inc. | Combined environmentally sealed telephone terminal module and covered telephone jack | 
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc | 
| Feb 25 2002 | LI, CHANG-YOU | RiteKom Photonics Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012941 | /0738 | |
| Feb 25 2002 | HO, ING-JER | RiteKom Photonics Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012941 | /0738 | |
| Feb 25 2002 | CHIANG, LING-YING | RiteKom Photonics Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012941 | /0738 | |
| Feb 25 2002 | HUNG, TUAN-YU | RiteKom Photonics Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012941 | /0738 | |
| Feb 25 2002 | HSIEH, WEN-CHIH | RiteKom Photonics Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012941 | /0738 | |
| May 24 2002 | RiteKom Photonics Corporation | (assignment on the face of the patent) | / | 
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