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We claim the ornamental design for a communication module, as shown and described.
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FIG. 1 is a perspective view illustrating the top, front and right side of a design for a communication module;
FIG. 2 is a perspective view illustrating the bottom, front and right side of a design for the communication module illustrated in FIG. 1;
FIG. 3 is a top plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a rear elevational view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is a perspective view illustrating the top, front and right side of another embodiment of the design for the communication module;
FIG. 10 is a perspective view illustrating the bottom, front and right side of a design for the communication module illustrated in FIG. 9;
FIG. 11 is a top plan view thereof;
FIG. 12 is a right side elevational view thereof;
FIG. 13 is a left side elevational view thereof;
FIG. 14 is a bottom plan view thereof;
FIG. 15 is a perspective view illustrating the top, front and right side of yet another embodiment of the design for the communication module;
FIG. 16 is a perspective view illustrating the bottom, front and right side of the design for the communication module illustrated in FIG. 15;
FIG. 17 is a top plan view thereof;
FIG. 18 is a right side elevational view thereof;
FIG. 19 is a left side elevational view thereof;
FIG. 20 is a bottom plan view thereof;
FIG. 21 is a perspective view illustrating the top, front and right side of further embodiment of the design for the communication module;
FIG. 22 is a top plan view of the design for the communication module illustrated in FIG. 21;
FIG. 23 is a right side elevational view thereof;
FIG. 24 is a left side elevational view thereof;
FIG. 25 is a rear elevational view thereof;
FIG. 26 is a perspective view illustrating the top, front and right side of yet a further embodiment of the design for the communication module;
FIG. 27 is a top plan view of the design for the communication module illustrated in FIG. 21;
FIG. 28 is a right side elevational view thereof;
FIG. 29 is a left side elevational view thereof;
FIG. 30 is a perspective view illustrating the top, front and right side of another further embodiment of the design for the communication module;
FIG. 31 is a top plan view of the design for the communication module illustrated in FIG. 30;
FIG. 32 is a right side elevational view thereof; and,
FIG. 33 is a left side elevational view thereof.
Trezza, John, Kang, Keith, Stack, Richard, Dugas, Roger, Czoschke, Mark
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Mar 15 2002 | TREZZA, JOHN | XANOPTIX, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012897 | /0095 | |
Mar 15 2002 | DUGAS, ROGER | XANOPTIX, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012897 | /0095 | |
Mar 15 2002 | KANG, KEITH | XANOPTIX, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012897 | /0095 | |
Mar 15 2002 | CZOSCHKE, MARK | XANOPTIX, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012897 | /0095 | |
Mar 18 2002 | Xanoptix, Inc. | (assignment on the face of the patent) | / | |||
Mar 25 2002 | STACK, RICHARD | XANOPTIX, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012897 | /0095 | |
Oct 19 2004 | XANOPTIX, INC | XAN3D TECHNOLOGIES, INC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 021242 | /0300 | |
Aug 16 2005 | XAN3D TECHNOLOGIES, INC | CUBIC WAFER, INC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 021361 | /0214 | |
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