Patent
   D477312
Priority
Mar 18 2002
Filed
Mar 18 2002
Issued
Jul 15 2003
Expiry
Jul 15 2017
Assg.orig
Entity
unknown
3
8
n/a
We claim the ornamental design for a communication module, as shown and described.

FIG. 1 is a perspective view illustrating the top, front and right side of a design for a communication module;

FIG. 2 is a perspective view illustrating the bottom, front and right side of a design for the communication module illustrated in FIG. 1;

FIG. 3 is a top plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a rear elevational view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a perspective view illustrating the top, front and right side of another embodiment of the design for the communication module;

FIG. 10 is a perspective view illustrating the bottom, front and right side of a design for the communication module illustrated in FIG. 9;

FIG. 11 is a top plan view thereof;

FIG. 12 is a right side elevational view thereof;

FIG. 13 is a left side elevational view thereof;

FIG. 14 is a bottom plan view thereof;

FIG. 15 is a perspective view illustrating the top, front and right side of yet another embodiment of the design for the communication module;

FIG. 16 is a perspective view illustrating the bottom, front and right side of the design for the communication module illustrated in FIG. 15;

FIG. 17 is a top plan view thereof;

FIG. 18 is a right side elevational view thereof;

FIG. 19 is a left side elevational view thereof;

FIG. 20 is a bottom plan view thereof;

FIG. 21 is a perspective view illustrating the top, front and right side of further embodiment of the design for the communication module;

FIG. 22 is a top plan view of the design for the communication module illustrated in FIG. 21;

FIG. 23 is a right side elevational view thereof;

FIG. 24 is a left side elevational view thereof;

FIG. 25 is a rear elevational view thereof;

FIG. 26 is a perspective view illustrating the top, front and right side of yet a further embodiment of the design for the communication module;

FIG. 27 is a top plan view of the design for the communication module illustrated in FIG. 21;

FIG. 28 is a right side elevational view thereof;

FIG. 29 is a left side elevational view thereof;

FIG. 30 is a perspective view illustrating the top, front and right side of another further embodiment of the design for the communication module;

FIG. 31 is a top plan view of the design for the communication module illustrated in FIG. 30;

FIG. 32 is a right side elevational view thereof; and,

FIG. 33 is a left side elevational view thereof.

Trezza, John, Kang, Keith, Stack, Richard, Dugas, Roger, Czoschke, Mark

Patent Priority Assignee Title
D908606, Jul 24 2018 Sharp Kabushiki Kaisha Dye-sensitized solar cell module
D910539, Jul 24 2018 Sharp Kabushiki Kaisha Communication module with solar cell
D925441, Jul 24 2018 Sharp Kabushiki Kaisha; KOBATA GAUGE MANUFACTURING CO , LTD Data transmitter with solar cell and sensor
Patent Priority Assignee Title
5035652, May 22 1989 Hosiden Electronics Co., Ltd. Multipin connector socket
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D374663, Nov 08 1994 Data connector
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Mar 15 2002TREZZA, JOHNXANOPTIX, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128970095 pdf
Mar 15 2002DUGAS, ROGERXANOPTIX, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128970095 pdf
Mar 15 2002KANG, KEITHXANOPTIX, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128970095 pdf
Mar 15 2002CZOSCHKE, MARKXANOPTIX, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128970095 pdf
Mar 18 2002Xanoptix, Inc.(assignment on the face of the patent)
Mar 25 2002STACK, RICHARDXANOPTIX, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128970095 pdf
Oct 19 2004XANOPTIX, INC XAN3D TECHNOLOGIES, INC CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0212420300 pdf
Aug 16 2005XAN3D TECHNOLOGIES, INC CUBIC WAFER, INC CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0213610214 pdf
Mar 21 2008CUBIC WAFER, INC CUFER ASSET LTD L L C ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0211710907 pdf
Nov 26 2019CUFER ASSET LTD L L C INTELLECTUAL VENTURES ASSETS 161 LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0518730365 pdf
Dec 06 2019INTELLECTUAL VENTURES ASSETS 161 LLCHANGER SOLUTIONS, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0521590509 pdf
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