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The ornamental design for CPU board assembly panel, as shown and described.
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FIG. 1 is a bottom view thereof;
FIG. 2 is a top view thereof;
FIG. 3 is a back elevational view thereof;
FIG. 4 is a left side elevational view thereof; and,
FIG. 5 is a right side elevational view thereof.
The broken lines are shown in the views for illustrative purposes only and form no part of the claimed design.
Frank, Christopher H., Mori, Robert F.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Mar 21 2001 | Sun Microsystems, Inc. | (assignment on the face of the patent) | / | |||
| Apr 25 2001 | FRANK, CHRISTOPHER H | Sun Microsystems, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011897 | /0745 | |
| Apr 25 2001 | MORI, ROBERT F | Sun Microsystems, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011897 | /0745 |
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