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The ornamental design for a headphone, as shown.
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FIG. 1 is a perspective view of the front and right side of a headphone showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Kawakami, Hiroko, Tanaka, Ayako, Kanada, Mitsuaki, Yamaoka, Kazuhiko
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 11 2002 | KAWAKAMI, HIROKO | NEC Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013284 | /0845 | |
Jul 11 2002 | TANAKA, AYAKO | NEC Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013284 | /0845 | |
Jul 11 2002 | KANADA, MITSUAKI | NEC Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013284 | /0845 | |
Jul 11 2002 | YAMAOKA, KAZUHIKO | NEC Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013284 | /0845 | |
Sep 10 2002 | NEC Corporation | (assignment on the face of the patent) | / |
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