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The ornamental design for a microphone boom for a headset, as shown and described.
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FIG. 1 is a lower rear left perspective view of a microphone boom for a headset, the broken line drawing of an earloop of the headset in drawings herein is for illustrative purposes only and forms no part of the claimed design;
FIG. 2 is a lower front right perspective view;
FIG. 3 is a front elevational view;
FIG. 4 is a right side elevational view;
FIG. 5 is a rear elevational view;
FIG. 6 is a left side elevational view;
FIG. 7 is a top plan view; and,
FIG. 8 is a bottom plan view.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 07 2003 | Plantronics, Inc. | (assignment on the face of the patent) | / | |||
Jan 07 2003 | HAM, SOOHYUN | Plantronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013652 | /0573 |
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