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The ornamental design for a blister pack, as shown.
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FIG. 1 is a perspective view showing my design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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| Jan 30 2003 | LEE, WAI CHUNG DAVID | Koninklijke Philips Electronics N V | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013918 | /0052 | |
| Mar 26 2003 | Koninklijke Philips Electronics N.V. | (assignment on the face of the patent) | / |
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