Patent
   D480964
Priority
Oct 16 2002
Filed
Mar 26 2003
Issued
Oct 21 2003
Expiry
Oct 21 2017
Assg.orig
Entity
unknown
37
7
n/a
The ornamental design for a blister pack, as shown.

FIG. 1 is a perspective view showing my design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Lee, Wai Chung David

Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 30 2003LEE, WAI CHUNG DAVIDKoninklijke Philips Electronics N VASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0139180192 pdf
Mar 26 2003Koninklijke Philips Electronics N.V.(assignment on the face of the patent)
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