Patent
   D481451
Priority
Dec 09 2002
Filed
Dec 09 2002
Issued
Oct 28 2003
Expiry
Oct 28 2017
Assg.orig
Entity
unknown
4
2
n/a
The ornamental design for heat dissipator, as shown and described.

FIG. 1 is a perspective view of heat dissipator showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Luo, Chin-Kuang

Patent Priority Assignee Title
7055578, Jun 03 2004 Hon Hai Precision Industry Co., Ltd. Heat dissipation device assembly with fan cover
7878232, Jul 09 2004 ALLY BANK, AS COLLATERAL AGENT; ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
D595399, Mar 12 2009 CompTake Technology Inc. Heat dissipating fan
D882749, Dec 13 2016 PAT TECHNOLOGY SYSTEMS, INC. Blower
Patent Priority Assignee Title
6411511, Sep 14 2001 PORTWELL INC. Motherboard heat sink passage and support board
D398392, Oct 07 1997 Sunonwealth Electric Machine Industry Co. Ltd. Heat dissipation fan
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