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The ornamental design for a heat-dissipation fan assembly, as shown in the accompanying drawings.
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FIG. 1 is a perspective view of the heat-dissipation fan assembly in accordance with the embodiment of the claimed design;
FIG. 2 is a right side elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.
Horng, Alex, Hsieh, Tsung-Min, Hong, Ching-Sheng, Horng, Yin-Rong
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
5335722, | Sep 30 1993 | Global Win Technology Co., Ltd; Huei Bin Enterprise Corp. | Cooling assembly for an integrated circuit |
6525939, | Aug 08 2000 | Wistron Corporation; Acer Incorporated | Heat sink apparatus |
6587341, | Mar 04 2002 | Chun Long Metal Co., Ltd. | Heat dissipater structure |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 17 2003 | HORNG, ALEX | SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013847 | /0163 | |
Feb 17 2003 | HORNG, YIN-RONG | SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013847 | /0163 | |
Feb 17 2003 | HONG, CHING-SHENG | SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013847 | /0163 | |
Feb 17 2003 | HSIEH, TSUNG-MIN | SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013847 | /0163 | |
Mar 07 2003 | Sunonwealth Electric Machine Industry Co., Ltd. | (assignment on the face of the patent) | / |
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