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The ornamental design for clip for securing a heat-dissipating module, as shown and described herein.
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FIG. 1 is a perspective view of clip for securing a heat-dissipating module showing our new design;
FIG. 2 is a right side view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a rear view thereof.
Lin, Kuo-cheng, Huang, Wen-shi, Hsia, Chih-Hao
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 25 2002 | HSIA, CHIH-HAO | DELTA ELECTRONICS INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013521 | /0979 | |
Oct 01 2002 | LIN, KUO-CHENG | DELTA ELECTRONICS INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013521 | /0979 | |
Oct 01 2002 | HUANG, WEN-SHI | DELTA ELECTRONICS INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013521 | /0979 | |
Nov 25 2002 | Delta Electronics Inc. | (assignment on the face of the patent) | / |
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