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The ornamental design for a computer mainframe front panel, as shown and described.
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FIG. 1 is a top, front and right side perspective view of a computer mainframe front panel showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Patent | Priority | Assignee | Title |
D500046, | Mar 11 2004 | Chi-Chun, Lin | Computer front panel |
D502948, | Feb 04 2004 | Thermaltake Technology Co., Ltd. | Computer mainframe front panel |
D539287, | Nov 03 2005 | Hon Hai Precision Industry Co. Ltd | Front bezel for computer enclosure |
D561774, | Feb 01 2006 | International Business Machines Corporation | Acoustic rack door for a computer server system |
D562329, | Feb 01 2006 | International Business Machines Corporation | Acoustic rack door for a computer server system |
Patent | Priority | Assignee | Title |
D454133, | Jan 12 2001 | Lite-On Enclosure, Inc. | Panel |
D464357, | Dec 28 2001 | Hon Hai Precision Ind. Co., Ltd. | Computer front bezel |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 13 2003 | HUANG, HUI-CHIA | THERMALTAKE TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013688 | /0601 | |
Jan 22 2003 | Thermaltake Technology Co., Ltd. | (assignment on the face of the patent) | / |
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