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The ornamental design for an electronic device enclosure, as shown.
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FIG. 1 is a perspective view of an electronic device enclosure of my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 10 2002 | WEI, TZU-HAO | HON HAI PRECISION IND CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013121 | /0028 | |
Jul 15 2002 | Hon Hai Precision Ind. Co., Ltd. | (assignment on the face of the patent) | / |
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