Patent
   D485612
Priority
Jan 16 2003
Filed
Mar 14 2003
Issued
Jan 20 2004
Expiry
Jan 20 2018
Assg.orig
Entity
unknown
1
4
n/a
The ornamental design for heat dissipator, as shown and described.

FIG. 1 is a persective view of heat dissiptator showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Luo, Chin-Kuang

Patent Priority Assignee Title
7878232, Jul 09 2004 ALLY BANK, AS COLLATERAL AGENT; ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
Patent Priority Assignee Title
5335722, Sep 30 1993 Global Win Technology Co., Ltd; Huei Bin Enterprise Corp. Cooling assembly for an integrated circuit
6377458, Jul 31 2000 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump
6525939, Aug 08 2000 Wistron Corporation; Acer Incorporated Heat sink apparatus
6587341, Mar 04 2002 Chun Long Metal Co., Ltd. Heat dissipater structure
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